Die Bonder - Company Ranking(8 companies in total)
Last Updated： Aggregation Period:Sep 09, 2026〜Oct 06, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| [About ASMPT's Flip Chip/Die Bonder] We offer a lineup of products with alignment accuracy ranging from 0.2μm to 25μm and cycle times from... | Various packages and applications such as QFN, BGA, MEMS, SiP, thin chips, and large dies. | ||
| ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ... | LED-related items such as COB, CSP, phosphor film, and TOcan. | ||
| Alignment accuracy: ± 7 μm @ 3σ Cycle time: 540 ms Die size compatibility: 0.15 x 0.15 – 2 x 2 mm Substrate size compatibility: up to ... | - Applications: Automotive, Photonics, LED, LiDAR | ||
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兼松ＰＷＳ
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- Featured Products
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ASMPT's epoxy die bonder "INFINITE" <New Release>
- overview
- [About ASMPT's Flip Chip/Die Bonder] We offer a lineup of products with alignment accuracy ranging from 0.2μm to 25μm and cycle times from...
- Application/Performance example
- Various packages and applications such as QFN, BGA, MEMS, SiP, thin chips, and large dies.
ASMPT manufactured AD838L-G2 epoxy die bonder
- overview
- ASMPT's flip chip/die bonder offers alignment accuracy ranging from 0.2μm to 25μm, with cycle times from 18 seconds to 0.16 seconds. We can ...
- Application/Performance example
- LED-related items such as COB, CSP, phosphor film, and TOcan.
ASMPT manufactured eutectic die bonder
- overview
- Alignment accuracy: ± 7 μm @ 3σ Cycle time: 540 ms Die size compatibility: 0.15 x 0.15 – 2 x 2 mm Substrate size compatibility: up to ...
- Application/Performance example
- - Applications: Automotive, Photonics, LED, LiDAR
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兼松ＰＷＳ
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